Shortly after Huawei brought to light its new scaling law called Tao Scaling Law and its LogicFolding architecture, the company held a keynote at the Phoenix Bay Area Finance Forum and Financial Summit in Shenzhen, promising to bring a much more powerful, next-generation Kirin chipset that will power the upcoming Mate 90 lineup.
The chip in question is said to be the first mobile chip for the company built on the LogicFolding architecture, and will be able to compete with 3nm chips. Interestingly, the spokesperson didn’t exactly say that the next Kirin chip will be 3nm, but instead…
Shortly after Huawei brought to light its new scaling law called Tao Scaling Law and its LogicFolding architecture, the company held a keynote at the Phoenix Bay Area Finance Forum and Financial Summit in Shenzhen, promising to bring a much more powerful, next-generation Kirin chipset that will power the upcoming Mate 90 lineup.
The chip in question is said to be the first mobile chip for the company built on the LogicFolding architecture, and will be able to compete with 3nm chips. Interestingly, the spokesperson didn’t exactly say that the next Kirin chip will be 3nm, but instead… Read More GSMArena.com – Latest articles
