Aside from the Snapdragon 8 Gen 3 mobile SoC and the Snapdragon X Elite chipset for laptops, at its Snapdragon Summit today in Hawaii Qualcomm also took the wraps off its latest audio chips that will power future TWS earbuds, headphones, and speakers.
Meet the Qualcomm Snapdragon S7 and S7 Pro Gen 1 Sound platforms with Bluetooth 5.4. The S7 Pro brings micro-power Wi-Fi (capable of speeds up to 29 Mbps) to your next pair of earbuds in order to extend their range “far beyond what is possible today using only Bluetooth”, Qualcomm says, with seamless transitioning between Bluetooth and…
Aside from the Snapdragon 8 Gen 3 mobile SoC and the Snapdragon X Elite chipset for laptops, at its Snapdragon Summit today in Hawaii Qualcomm also took the wraps off its latest audio chips that will power future TWS earbuds, headphones, and speakers.
Meet the Qualcomm Snapdragon S7 and S7 Pro Gen 1 Sound platforms with Bluetooth 5.4. The S7 Pro brings micro-power Wi-Fi (capable of speeds up to 29 Mbps) to your next pair of earbuds in order to extend their range “far beyond what is possible today using only Bluetooth”, Qualcomm says, with seamless transitioning between Bluetooth and… Read More GSMArena.com – Latest articles
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